Flipchip International, LLC v. Pac Tech USA, Inc. et al
Plaintiff: Flipchip International, LLC
Defendant: Pac Tech USA, Inc. and Pac Tech Packaging Technologies GMBH
Case Number: 4:2008cv05214
Filed: November 20, 2008
Court: US District Court for the Northern District of California
Office: Patent Office
County: Santa Clara
Presiding Judge: Wayne D. Brazil
Nature of Suit: Plaintiff
Cause of Action: Federal Question
Jury Demanded By: 35:271 Patent Infringement

Available Case Documents

The following documents for this case are available for you to view or download:

Date Filed Document Text
February 4, 2009 Opinion or Order Filing 14 ORDER by Judge Brazil granting 12 Motion Continue CMC and Associated Deadlines. (wdblc3, COURT STAFF) (Filed on 2/4/2009)
February 2, 2009 Opinion or Order Filing 11 ORDER by Judge Brazil granting 4 Motion for Pro Hac Vice re: Scott J. Bornstein. (wdblc3, COURT STAFF) (Filed on 2/2/2009) Modified on 2/3/2009 (cjl, COURT STAFF).
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Plaintiff: Flipchip International, LLC
Represented By: James William Soong
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Defendant: Pac Tech USA, Inc.
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Defendant: Pac Tech Packaging Technologies GMBH
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