TAIWAN SEMICONDUCTOR V ITC
Plaintiff: MOTOROLA, INC.
Plaintiff-Appellee: ALLIANCE SEMICONDUCTOR CORPORATION, GALVANTECH, INC., INTEGRATED SILICON SOLUTION, INC., TAIWAN SEMICONDUCTOR INDUSTRY ASSOCIATION, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. and WINBOND ELECTRONICS CORPORATION
Defendant-Appellant: MICRON TECHNOLOGY, INC
Defendant-Appellee: UNITED STATES INTERNATIONAL TRADE COMMISSION
Case Number: 01-1060
Filed: October 23, 2000
Court: U.S. Court of Appeals, Federal Circuit
Nature of Suit: Other
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Plaintiff-appellee: ALLIANCE SEMICONDUCTOR CORPORATION
Represented By: CORR, CHRISTOPHER F.
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Plaintiff-appellee: GALVANTECH, INC.
Represented By: CORR, CHRISTOPHER F.
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Plaintiff-appellee: INTEGRATED SILICON SOLUTION, INC.
Represented By: CORR, CHRISTOPHER F.
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Plaintiff-appellee: TAIWAN SEMICONDUCTOR INDUSTRY ASSOCIATION
Represented By: VANDER SCHAAF, LYLE B.
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Plaintiff-appellee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Represented By: CORR, CHRISTOPHER F.
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Plaintiff-appellee: WINBOND ELECTRONICS CORPORATION
Represented By: CORR, CHRISTOPHER F.
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Defendant-appellant: MICRON TECHNOLOGY, INC
Represented By: KAPLAN, GILBERT B.
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Plaintiff: MOTOROLA, INC.
Represented By: APPLEBAUM, HARVEY M.
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Defendant-appellee: UNITED STATES INTERNATIONAL TRADE COMMISSION
Represented By: DIEHL, MICHAEL
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