Qualcomm Incorporated et al v. Wi-LAN Inc.
| Qualcomm Incorporated and Qualcomm Technologies, Inc. |
| Wi-LAN Inc. |
| 1:2026mc00314 |
| June 25, 2026 |
| U.S. District Court for the District of Delaware |
| Other Statutory Actions |
| Motion to Compel |
| None |
Docket Report
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This docket was last retrieved on June 26, 2026. A more recent docket listing may be available from PACER.
| Document Text |
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Filing 7
ORDER granting #1 MOTION for Leave to File Under Seal. Qualcomm shall file a public version of the opening brief and supporting papers within 7 days of the docketing. Signed by Judge Jennifer L. Hall on 6/26/2026. (lah)
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| Remark: Exit electronic copies to Judge JLH. (lah) |
| Filing 6 Disclosure Statement pursuant to Rule 7.1: identifying Corporate Parent Qualcomm Incorporated for Qualcomm Technologies, Inc. filed by Qualcomm Incorporated, Qualcomm Technologies, Inc. (lah) |
| Filing 5 [SEALED] DECLARATION of Michael A. Bittner in Support of #2 MOTION to Compel Compliance with Subpoenas Duces Tecum and Ad Testificandum - filed by Qualcomm Incorporated, Qualcomm Technologies, Inc. (Attachments: #1 Exhibit 1-16, #2 Exhibit 17, #3 Exhibit 18-31) (lah) |
| Filing 4 [SEALED] OPENING BRIEF in Support of #2 MOTION to Compel Compliance with Subpoenas Duces Tecum and Ad Testificandum - filed by Qualcomm Incorporated, Qualcomm Technologies, Inc. Answering Brief/Response due date per Local Rules is 7/9/2026. (lah) |
| Filing 3 Notice, Consent and Referral forms re: U.S. Magistrate Judge jurisdiction. (lah) |
| Filing 2 MOTION to Compel Compliance with Subpoenas Duces Tecum and Ad Testificandum - filed by Qualcomm Incorporated, Qualcomm Technologies, Inc. (Attachments: #1 Text of Proposed Order, #2 Civil Cover Sheet)(lah) |
| Filing 1 MOTION for Leave to File Under Seal - filed by Qualcomm Incorporated, Qualcomm Technologies, Inc. (Attachments: #1 Text of Proposed Order) (lah) |
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