Cases 1 - 3 of 3
INVENSAS BONDING TECHNOLOGIES, INC. v. SAMSUNG ELECTRONICS AMERICA, INC. et al
as 1:2017cv07609
Plaintiff:
INVENSAS BONDING TECHNOLOGIES, INC.
Defendant:
SAMSUNG ELECTRONICS AMERICA, INC. and SAMSUNG ELECTRONICS CO., LTD.
Cause Of Action: 15 U.S.C. § 1126
RAPID RELEASE BAIL BONDS, INC. v. RAPID BAIL BONDS, LLC et al
as 2:2012cv02212
Plaintiff:
RAPID RELEASE BAIL BONDS, INC.
Defendant:
RAPID BAIL BONDS, LLC, JOHN SMITH and ABC COMPANIES
Cause Of Action: 15 U.S.C. § 1125
MEDFORD COMMONS, LLC et al v. LEXON INSURANCE COMPANY et al
as 1:2011cv00188
Plaintiff:
MEDFORD COMMONS, LLC
Defendant:
LEXON INSURANCE COMPANY and BOND SAFEGUARD INSURANCE COMPANY
Intervenor_plaintiff:
TOWNSHIP OF MEDFORD
Fourthparty_defendant:
PENNONI ASSOCIATES, INC. , CHRISTOPHER CONLON, PETER RIPKA and others
Thirdparty_defendant:
FREEDMAN COHEN DEVELOPMENT, LLC , MEDFORD VILLAGE EAST ASSOCIATES, LLC , CARL FREEDMAN and others
Thirdparty_plaintiff:
LEXON INSURANCE COMPANY and BOND SAFEGUARD INSURANCE COMPANY
Fourthparty_plaintiff:
STEPHEN D. SAMOST and MEDFORD VILLAGE EAST ASSOCIATES, LLC
Cross_claimant:
MEDFORD VILLAGE EAST ASSOCIATES, LLC
Cross_defendant:
MITCHELL COHEN , CARL FREEDMAN and FREEDMAN COHEN DEVELOPMENT, LLC
Counter_claimant:
MEDFORD VILLAGE EAST ASSOCIATES, LLC
Counter_defendant:
LEXON INSURANCE COMPANY and BOND SAFEGUARD INSURANCE COMPANY
Cause Of Action: 17 U.S.C. § 101
Disclaimer: Justia Dockets & Filings provides public litigation records from the federal appellate and district courts. These filings and docket sheets should not be considered findings of fact or liability, nor do they necessarily reflect the view of Justia.
